深圳市赛特微电子有限公司 （非本站正式会员）

RS1008FL

FEATURES
• For surface mounted applications
• Low profile package
• Ideal for automated placement
• Glass Passivated Chip Junction
• High temperature soldering : 260OC / 10 seconds at terminals
• Pb free product : 99% Sn above can meet RoHS environment substance
directive request
SMALL SURFACE MOUNT FAST DIODES
VOLTAGE 100 to 800 Volts CURRENT 1.0 Amperes
MECHANICAL DATA
• Case: JEDEC DO-219AB,Molded plastic over passivated junction
• Terminals: Solderable per MIL-STD-750, Method 2026
• Standard Packaging : 8mm tape (EIA-481)
• Approx. Weight: 0.0168 gram
Rating Test condition Symbol RS1001FL RS1002FL RS1004FL RS1006FL RS1008FL Units
Maximum repetitve peak reverse voltage V RRM 100 200 400 600 800 V
Maximum RMS voltage V RMS 70 140 280 420 560 V
Maximum DC blocking voltage V D C 100 200 400 600 800 V
Maximum average forward rectified current Ttp =65OC
TA =45OC I F(AV)
1.4
0.5 A
Maximum instantaneous forward voltage 0.7A VF 1.15 V
Maximum DC reverse current at rated DC
blocking voltage
TA =25OC
TA =125OC IR
10
50 μA
Thermal resistance junction to ambient air RϑJA 180 K/W
Operating junction and storage temperature
range TJ T , STG -50 TO + 150 OC
Reverse recovery time
IF =0.5A
IR =1A
t rr =0.25A
t rr 150 250 500 nS
Typical capacitance 4V,1MHz CJ 9 pF
MAXIMUM