- IC型号
深圳市赛特微电子有限公司
- 营业执照：未审核经营模式：生产企业所在地区：广东 深圳企业网站：
http://www.p-h-y.com
收藏本公司 人气：656179
联系方式
- 地址：门市：深圳市福田区中航路新亚洲1C010/公司：深圳市福田区深南中路华强佳和大厦B座2703
- 联系人：赵小姐/吕先生
- 电话：755-82812160
- 传真：755-83558790
- 手机：13760183855
- QQ：
- E-mail：2355411774@qq.com
产品分类
- 贴片/片式/SMD二极管(1)
- 肖特基二极管(1)
DFLZ10原装TAYCHIPST台芯半导体现货供应，环保现货DFLZ10价格优惠
- 产品价格：
- 电话咨询/ 1pcs
- 交易说明：
- 全新原装房间现货！！
- 厂 家：
- TAYCHIPST
- 封 装：
- SOD-123FL
- 批 号：
- 2012
- 数 量：
- 50000
产品咨询直线：755-82812160
产品详细说明
| 描述 | 功率齐纳二极管 10V |
| 制造商 | TAYCHIPST |
| 产品种类 | 功率齐纳二极管 |
| Nom (V) | 10 V |
| Min (V) | 9.4V |
| Max (V) | 10.6V |
| 配置 | Single |
| 工作温度范围 | - 55 C to + 150 C |
| 安装风格 | SMD/SMT |
| 封装 / 箱体 | SOD-123FL |
| 封装 | Reel |
· Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
· Moisture Sensitivity: Level 1 per J-STD-020C
· Terminal Connections: Cathode Band
· Terminals: Finish - Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202,
Method 208
· Marking & Type Code Information: See Electrical
Specifications Table and Page 3
· Ordering Information: See Last Page
· Weight: 0.01 grams (approximate)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Mechanical Data
· 1W Power Dissipation on FR-4 PCB
· Lead Free Finish, RoHS Compliant (Note 2)
· "Green" Molding Compound (No Br, Sb)
· Qualified to AEC-Q101 Standards for High Reliability
e3
· Case: PowerDIä123
· Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
· Moisture Sensitivity: Level 1 per J-STD-020C
· Terminal Connections: Cathode Band
· Terminals: Finish - Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202,
Method 208
· Marking & Type Code Information: See Electrical
Specifications Table and Page 3
· Ordering Information: See Last Page
· Weight: 0.01 grams (approximate)
Maximum Ratings @ TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Forward Voltage @ IF = 200mA VF 1.2 V
Operating and Storage Temperature Range Tj, TSTG -55 to +150 °C
Thermal Characteristics @ TA = 25°C unless otherwise specified
Characteristic Symbol Typ Max Unit
Power Dissipation (Note 1) PD ¾ 1.0 W
Thermal Resistance, Junction to Ambient Air (Note 1) RqJA 110 ¾ °C/W
Thermal Resistance, Junction to Soldering Point (Note 3) RqJS ¾ 9 °C/W
Notes: 1. Device mounted on 1" x 1", FR-4 PCB; 2 oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf.
2. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
3. Theoretical RqJS calculated from the top center of the die straight down to the PCB/cathode tab solder junction.
SURFACE MOUNT POWER ZENER DIODE
5.1V-39V 1.0W
实体认证查看诚信档案
| 具体铺位： | 门市：深圳市福田区中航路新亚洲1C010/公司：深圳市福田区深南中路华强佳和大厦B座2703 | 仓库位置： | 广东深圳深圳市福田区新亚洲1C010/新亚洲4A036 |
|---|---|---|---|
| 场地合同： | 已核查 | 核查时间： |
